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Dixon Tech Expands Into AI Infrastructure and Advanced Packaging Business

Dixon Tech Expands Into AI Infrastructure and Advanced Packaging

Short2News· 1h ago ·👁 1 reads

Dixon is venturing into silicon photonics and advanced packaging to tap into the booming market for AI infrastructure and data centers. This strategic shift moves the company beyond standard smartphone manufacturing into high-margin global technology sectors. The initiative aims to strengthen India's position in advanced electronics and high-tech hardware production.

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